WAKOL RP 104 Decoupling Sheet, 4 mm

WAKOL RP 104 Decoupling Sheet, 4 mm Installation Information

Subfloors

WAKOL RP 104 Decoupling Sheet, 4 mm is especially well suited to renovating nonstandardised, e.g. severely cracked, inhomogeneous, not fully stable but load-bearing subfloors indoors. Subfloors must be permanently dry, solid, level, free from dirt and adhesioninhibiting substances. Use a suitable mechanical procedure to remove separating layers.

Usage

Bond WAKOL decoupling sheet in conjunction with suitable WAKOL MS or PU Parquet Adhesive, e.g. WAKOL MS 260 Parquet Adhesive, firm-elastic or WAKOL PU 225 Parquet Adhesive with trowel TKB B5, B11 or B13. Only spread as much adhesive as can be processed within the working time. Only spread as much adhesive as can be processed within the working time. Insert the decoupling sheet and rub in or roll. Use a trapezoidal blade, jigsaw, circular saw or angle grinder (diamond cutting disc) for cutting work. For rising components, in the case of mineral subfloors an edge joint of min. 5 mm and in the case of wooden subfloors of min. 10 mm must be ensured. With the use of WAKOL MS or PU adhesives the subsequent parquet laying can only be started as soon as the bonded panel or sheet is suitable for walking without shifting. A drying time of 12 hours must be observed for subsequent levelling of the decoupling sheets. The parquet can be laid with WAKOL MS or PU Parquet Adhesives. The respective approvals of the manufacturer must be observed. The decoupling sheet can be levelled with WAKOL Z 615 Levelling Compound, dust-reduced, WAKOL Z 625 Levelling Compound, WAKOL Z 630 Levelling Compound, WAKOL Z 515 Thin Screed or WAKOL A 830 Levelling Compound with 3 mm minimum layer in order to subsequently lay textile and elastic flooring in living and office areas. The levelling compound is applied directly onto the clean board surface. Before the subsequent laying of textile and elastic flooring, allow the levelling compound to dry thoroughly. In the event of use for footfall sound reduction, no levelling compound must get between the board gaps in order to avoid the formation of acoustic bridges. The gaps between the boards must therefore be sealed with WAKOL MS 245 Montinator must be applied before the levelling compound is applied.

Important

Processing not below floor temperature of +15 °C and room temperature of +18 °C, as well as room humidity preferably between 40 % and 65 %, maximum 75 %. All information is based on approx. 20 °C and 50 % relative air humidity. Warm up all laying materials in due time in heated room. Not suitable for laying wood asphalt.